Pure Gold Paste Electrically and Thermally Conductive 2 Part Epoxy 24h Room Temp Cure

New

from

$0.00

Ex Tax: $0.00

Stock: In Stock
Brand: ConductiveX
Product Code: Electro-Bond G298

Available Options

Size

1.5gm pouch(s) (+$399.99)

2.5gm syringe(s) (+$549.99)

2.5gm pouch(s) (+$499.99)

5gm syringe(s) (+$999.99)

Qty

Add to Cart

Buy Now Question?

Add to Wish List Compare this Product

Pure Gold Paste Electrically and Thermally Conductive 2 Part Epoxy 24h Room Temp Cure

Description

AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging. This product is used in high-end medical and aerospace equipment to prevent cross-linking in high voltage / Amperage applications.

Benefits:

Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices.
It can be used in medical circuits using traditional hybrid packaging technologies.
High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.

Typical Applications:

Adhesive for joining die and SMDs onto the hybrid circuits.
Repairing defective Au thick-film conductor traces and contact pads.
Resisting oxidation and electro-migration in high-reliability microelectronics.
Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C

Typical Properties
Components	2
Mix Ratio	100/4
Working Life @ 25°C	30 Minutes
Particle Size	50
Shelf Life	1 year in syringes and 3 months in pouches/bi-paks
Cure Type	Room Temp or Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical

Physical Properties
Appearance	Gold
Filler	Gold
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Outgassing, NASA %CVCM	0
Compressive Strength, PSI	13000
Specific Gravity @ 25°C
Hardness	87
Lap Shear Strength	1000
Shrinkage Linear, IN/IN	0.003

Electrical Properties
Volume Resistivity	@ 23°C: ≤ 0.0009 Ohm-cm ohm. cm
Dielectric Strength	@ 23°C: ≥ 5 Kg / 1,700 psi

Thermal Properties
Operating Temp	from –50 to +130°C
Glass Transition Temp (Tg)	≥ 100°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp- 10—200°C @ 20°C/Min
Thermal Expansion Coefficient, per °C
Heat Distortion, °C	175

TDS / SDS

TDS | SDS

0 reviews • Write a review

Shipping & Returns

Create unlimited custom product blocks and display them in accordions or tabs or open blocks. Each block can be assigned to all products at once or specific products according to advanced criteria.

Additional Product Info

Create unlimited custom product blocks and display them in accordions or tabs or open blocks. Each block can be assigned to all products at once or specific products according to advanced criteria.