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- Brand: ConductiveX
- Product Code: Electro-Bond 63
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Graphite Filled Electrically Conductive Epoxy EMI RFI Shielding Adhesive Military Grade Heat Cure
Electro-Bond 63 is one component graphite fille epoxy designed for Esd/Emi Shielding of semiconductor devices and electronics. Electro-Bond 63 can be used in many electronic application. Electro-Bond 63 is free of solvents, develops strong and durable, bonds to differents and dissimilar materilas such as metals, ceramics, glass .
Typical Properties |
|
Components | 1 |
Working Life @ 25°C | 6 months |
Particle Size | 42 Micron |
Shelf Life | 6 months |
Cure Type | Heat Cure |
Typical Applications | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
Appearance | Grey |
Filler | Graphite |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 11000 |
Specific Gravity @ 25°C | 1.28 |
Hardness | 80 |
Lap Shear Strength | 2600 |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.003 |
Tensile Strength, PSI | 3600 |
Electrical Properties |
|
Volume Resistivity | 43 ohm. cm |
Thermal Properties |
|
Operating Temp | from –50 to +170°C |
Glass Transition Temp (Tg) | |
Thermal Expansion Coefficient, per °C | |
Heat Distortion, °C | 170 |
Thermal Conductivity W/M-K | 0.25 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 1.7 |
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