Thermally Conductive Adhesive Electrically Insulating Epoxy Fast Cure Heat Sink Staking

Thermo-Bond 56 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards. Thermo-Bond 56 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.

Typical Properties
Components	2
Mix Ratio	100/23
Working Life @ 25°C	5 Minutes
Particle Size	44
Shelf Life	1 year
Cure Type	Room Temp
Typical Applications
Fibers optic, potting and connectors
Physical Properties
Appearance	Grey
Filler	Alumina
Viscosity	12,000
Substrates	metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
Density @ 25°C
Compressive Strength, PSI	10000
Specific Gravity @ 25°C	2.25
Hardness	78
Lap Shear Strength	3400
Reactive Solids Content, %	100
Tensile Strength, PSI	3400
Electrical Properties
Volume Resistivity	5.40 E+15 ohm. cm
Thermal Properties
Operating Temp	from –50 to +110°C
Glass Transition Temp (Tg)	33 C
Thermal Expansion Coefficient, per °C	14.4
Heat Distortion, °C	160
Thermal Conductivity W/M-K	0.84
Thermal Conductivity BTU-IN/HR-FT²-°F	5.83