Thermally Conductive Electrically Insulating Heat Cure Epoxy High Temperature Resistance

Thermo-Bond 54 is recommended for high temperature aerospace and electronic applications where the combination of good thermal conductivity AND low electrical conductivity is required for thermal links (staking electrical components -- diodes, integrated circuits, transistors, precision resistors, or capacitors -- to chassis or circuit boards). This two-part thixotropic epoxy system is color coded for easy handling and mixing at room temperature -- although a final high temperature bake at 100°C is REQUIRED for full cure. Thermo-Bond 54 bonds strongly to ceramics (alumina, porcelain and beryllia), to glass and to many metals and plastics, and its thermal expansion coefficient is a good match for many other electronic materials (i.e. copper and aluminum) over a wide temperature range. The fully cured adhesive develops strong, durable electrically insulating/thermal conducting bonds with good impact properties, and which are also resistant to galvanic action, weathering, water, salts, mild alkalis and acids, many petroleum products, and many other organic and inorganic compounds. An additional post-cure of 4 hours at 145°C is recommended when application temperatures higher than 145°C are anticipated.

Typical Properties
Components	2
Mix Ratio	100/6
Working Life @ 25°C	3 hours
Particle Size	44
Shelf Life	1 year
Cure Type	Heat Cure / Room Temp Cure
Typical Applications
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards
Physical Properties
Appearance	Grey
Filler	Alumina
Viscosity	120000
Substrates	metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
Density @ 25°C
Compressive Strength, PSI	6500
Specific Gravity @ 25°C	2.43
Hardness	94
Lap Shear Strength	2000
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	10.1
Tensile Strength, PSI	3200
Electrical Properties
Volume Resistivity	5.00 E+15 ohm. cm
Dielectric Constant	6
Dielectric Strength	425
Thermal Properties
Operating Temp	from –50 to +160°C
Glass Transition Temp (Tg)	130
Thermal Expansion Coefficient, per °C
Heat Distortion, °C	130
Thermal Conductivity W/M-K	1
Thermal Conductivity BTU-IN/HR-FT²-°F	6.94