Electrically Conductive Silver Epoxy 1 Part Heat Cure Thermally Conductive Silver Loaded Adhesive

Electro-Bond 79 is one-part epoxy adhesive with superior electrical conductivity and bonding capability. It has been shown to retain these properties through hundreds of hours of rapid temperature cycling (-40 to 150°C). It also has superior impact absorption and stress resistance. These qualities make it an excellent choice for a number of electronic applications in harsh operating environments. Electro-Bond 79 has a shelf life of at least 3 months when stored at 25°C. It contains no volatile, harmful solvents or lead, and conforms to all of the requirements of the solder replacement market.

Typical Properties
Components	1
Working Life @ 25°C	3 months
Particle Size	44
Shelf Life	3 months
Cure Type	Heat Cure Only
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Physical Properties
Appearance	Silver
Filler	Silver
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	3600
Specific Gravity @ 25°C	2.62
Hardness	85
Lap Shear Strength	1720
Reactive Solids Content, %	100
Tensile Strength, PSI	1720
Electrical Properties
Volume Resistivity	3.00 E -3 ohm. cm
Thermal Properties
Operating Temp	from –50 to +150°C
Glass Transition Temp (Tg)	45°C
Thermal Expansion Coefficient, per °C
Heat Distortion, °C	150
Thermal Conductivity W/M-K	1.45
Thermal Conductivity BTU-IN/HR-FT²-°F	10.3