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- Brand: ConductiveX
- Product Code: Electro-Bond 14
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Flexible Copper Silver Thermally Conductive Epoxy Electrically Conductive Adhesive Room Temp Cure
Electro-Bond 14 is a Flexible epoxy adhesive and coating formulaton based on conductive copper. Electro-Bond 14 is recommended for electronic bonding and sealing applications that requied both electrical and mechanical properties. Electro-Bond 14 cures at room temperature or can be accelerated with mild heat to form strong bond between similar and dissimilar substrates.
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/15 |
Working Life @ 25°C | 45 Minutes |
Particle Size | 45 |
Shelf Life | 1 year |
Cure Type | Room Temp / Heat Cure |
Typical Applications | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
Appearance | Grey |
Filler | Silver/Copper |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 3000 |
Specific Gravity @ 25°C | 2.32 |
Hardness | 60 |
Lap Shear Strength | 9400 |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.003 |
Tensile Strength, PSI | 1240 |
Electrical Properties |
|
Volume Resistivity | 3.60 E+5 ohm. cm |
Dielectric Constant | 4.1 |
Dielectric Strength | 410 |
Dissipation Factor KV/IN | 0.015 |
Thermal Properties |
|
Operating Temp | from –50 to +170°C |
Glass Transition Temp (Tg) | 60°C |
Thermal Expansion Coefficient, per °C | 30 |
Heat Distortion, °C | 149 |
Thermal Conductivity W/M-K | 1.16 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 8.1 |
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