Flexible Electrically & Thermally Conductive Silver Epoxy, Flexible Electronic Component Repair

Electro-Bond 19 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties. elector Bond 19 is two-part, smooth paste adhesive of refined pure silver and epoxy resin components. It is free of solvents and copper or carbon additives. It develops strong, durable, resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates.

Typical Properties
Components	2
Mix Ratio	90/100
Working Life @ 25°C	30 Minutes
Particle Size	25
Shelf Life	1 year
Cure Type	Room Temp / Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Physical Properties
Appearance	Silver
Filler	Silver
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	3200
Specific Gravity @ 25°C	2.32
Hardness	78
Lap Shear Strength
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.003
Tensile Strength, PSI	2400
Electrical Properties
Volume Resistivity	1.00 E03 ohm. cm
Thermal Properties
Operating Temp	from –50 to +170°C
Glass Transition Temp (Tg)	30°C
Thermal Expansion Coefficient, per °C
Heat Distortion, °C	110
Thermal Conductivity W/M-K	1.5
Thermal Conductivity BTU-IN/HR-FT²-°F	10.6